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TC-1200RH Laser Flash Measuring System

Photonics.com
Dec 2011

 
YOKOHAMA, Japan, Dec. 28, 2011 — Ulvac-Riko Inc. has released the TC-1200RH, a laser flash thermal constant measuring system for research and development of electrical heating materials that enables stable measurement in low temperature ranges and cuts down measurement time.

As the demand for energy has increased, more attention has been paid to renewable energy and sustainable development. Heating materials and systems that can generate electricity from discarded waste heat energy have attracted attention. To develop these materials, evaluation in a low-temperature range, where it is easy to reuse waste heat and reduce measurement time to evaluate more samples, is required.

But existing resistance furnaces take hours to get a stable temperature reading in a low range, and they require more time to raise the temperature and to cool it down after measurement. So, only one measurement per day is possible.

The TC-1200RH uses an infrared gold image furnace to reduce measurement time.

In the laser flash method, temperature changes of samples are measured by infrared sensors. With the infrared gold image furnace, it was difficult to measure a sample’s temperature because infrared light from both an infrared lamp and a sample were mixed. So the company developed and patented a technique to separate them, enabling measurement of the temperature change by infrared sensors during infrared lamp heating.

The method provides temperature changes to a sample by delivering a laser pulse generated from a laser oscillator to the surface of the sample evenly and instantly. By measuring the temperature change of the back side of the sample, 1-D thermal diffusivity from the surface to the back side can be calculated. Specific heat can be calculated by measuring the temperature increase of the sample.

Applications include R&D of thermoelectric, metal and organic materials; evaluation of thermal diffusion and thermal conduction of materials; and R&D of thermal diffusion of materials such as semiconductor devices.

For more information, visit: www.ulvac-riko.com   


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