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Packaging Submounts

Photonics.com
Jan 2012
Remtec Inc.Request Info
 
NORWOOD, Mass., Jan. 5, 2012 — Remtec Inc. has added new capabilities for laser diode, LED and photodiode submounts and substrates, giving designers a wider variety of packaging options with ceramic submounts (alumina, beryllia, aluminum nitride), metal heat sinks and enhanced plated gold tin metallization. The improvements, along with the advantages of plated copper on thick film (PCTF) technology, enable many more options to gain higher performance from smaller, more cost-effective packages for electro-optical applications.

The company’s laser and photodiode submounts offer 25- to 75-μm-thick copper metallization with “zero pullback metallization” from a burr-free ceramic edge, enhancing the performance of edge-emitting diodes. An additional benefit is low-cost selective gold tin plating on ceramic submounts, used for both edge-emitting and vertical external-cavity surface-emitting laser diodes. The gold tin option also can be applied to copper tungsten submounts and laser bars, providing designers with more cost-effective and simplified packaging solutions for laser and photodiode submounts.

Many of the advantages of PCTF technology and the new packaging developments for laser and photodiodes are equally applicable to LED substrates. Designers of LED packaging may select alumina, beryllium oxide and aluminum nitride ceramic substrates with 25- to 75-μm-thick metallization and plugged vias, wraparounds and multilayer configurations. Plating finishes including selective gold, palladium and gold tin allow the use of various soldering materials and assembly techniques: gold wire bonding, brazing and epoxy die attach. The packaging options enable designers of LED devices to improve performance and to bring their products into production faster and with lower engineering costs.

Applications using laser and photodiode submounts and LED substrates include laser welding, cutting and marking systems; medical applications such as blood-oxygen sensors, transdermal delivery systems for medications and laser imaging; cosmetic applications for skin rejuvenation and hair removal; UV curing of light-sensitive dental materials; UV curing of industrial inks and adhesives; 3-D digital printing; and cinematic lighting.


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