Request InfoRemtec Inc.NORWOOD, Mass., Jan. 5, 2012 — Remtec Inc. has added new capabilities for laser diode, LED and photodiode submounts and substrates, giving designers a wider variety of packaging options with ceramic submounts (alumina, beryllia, aluminum nitride), metal heat sinks and enhanced plated gold tin metallization. The improvements, along with the advantages of plated copper on thick film (PCTF) technology, enable many more options to gain higher performance from smaller, more cost-effective packages for electro-optical applications. The company’s laser and photodiode submounts offer 25- to 75-μm-thick copper...See full productRelated content from Photonics MediaPRODUCTSPhotonics Spectra July 2023 IssueLaser Scanning Measurement SystemThe 3DS3000, a modular 3D laser scanning measurement and inspection system from Bold Laser Automation Inc. is designed for quality assurance processes. 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