The NSC1101 from New Imaging Technologies is a high-dynamic-range readout circuit that interfaces with photodiode arrays through flip chip bonding. In VGA format, it has 640 x 512 pixels with a 15-µm pitch. It can accept a photodiode array with p-on-n or n-on-p. Because of its proprietary Native Wide Dynamic Range of more than 120 dB, the sensor does not require any setting or exposure time control. It can be used with all infrared sensing materials, including InSb, InGaAs and HgCdTe, and it can operate at a cryogenic temperature of 80 K. Another photosensing material that can be used is AsGa for terahertz and x-ray detection. The sampling stage can be ordered in an 8-in.-wafer form.