OYAMA, Japan, Feb. 14, 2012 — Gigaphoton Inc. is introducing the GT63A, a next-generation deep-UV ArF excimer laser for multipatterning immersion lithography scanners. The laser incorporates sMPL (spectrum multipositioning LNM)*1, a spectrum control (“focus drilling”) technology that achieves a wide depth of focus; sGRYCOS (sixty gigaphoton recycled chamber operation system), a chamber technology that lowers operating costs; sTGM (supreme total gas manager), a gas management system that enables longer uptime with less process gas use; and sMONITORING (smart monitoring), real-time information management that tracks laser stability. The sMPL technology for focus drilling increases the laser spectrum control width, creating a greater depth of focus. Focus drilling enables expansion of the lithography process window for contact holes, trenches and vias, while avoiding negative effects on critical dimension uniformity, overlay and productivity. The sGRYCOS technology extends the effective life of a laser chamber, reducing factory operating costs. This durability results from increasing the strength of the pre-ionization electrode in a newly developed chamber and uses a robust pulse-power supply. The sTGM technology implements a wavelength calibration method to eliminate the need to routinely replace the laser chamber’s gas. It eliminates wasted process gases due to calibration requirements, reducing facility costs. The sMONITORING technology is an extension of existing real-time monitoring of laser performance and can be connected with the end user’s fault detection and classification system to monitor operation. It is a final check upon highly stable laser output to the scanner and on-wafer performance.