CRANSTON, R.I., Oct. 2, 2012 — A silicone compound for potting and encapsulating applications has been developed by Epoxies Etc. The 50-1225 compound provides good thermal conductivity, flexibility and high temperature resistance. The two-part silicone system is designed for electronic packages that require good flow around components, high thermal conductivity, cushioning for sensitive components and the ability to sustain environmental extremes. It is free of any flammable or toxic solvents and will cure in deep sections. It has a service temperature of −65 to 210 °C and will not support or promote a flame. The system cushions electronics through aging and thermal cycling, provides low shrinkage during cure, does not stress components and quickly transfers heat away from them.