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  • HPL-2400 Laser Diode Emulator and Load
Dec 2012
IXYS ColoradoRequest Info
FORT COLLINS, Colo., Dec. 25, 2012 — IXYS Corp. has introduced the HPL-2400, a high-power laser diode emulator and load that can dissipate up to 2400 W of power at precise load configurations to match any number of laser diodes and other high-power loads.

The HPL-2400 delivers reliability and repeatable test results. When testing fixtures, diode drivers or characterization setups, users can eliminate the risk to expensive diodes and obtain data using known load characteristics.

It features flexible, reliable, high-power loads that meet demanding needs. Standard load values of .125, .250, .500, 1, 2, 5 and 10 Ω are available. Custom values from .125 to 250 K Ω can be configured at the factory to match specific load characteristics. The status monitor allows users to monitor the temperature of the heat sink and provides a warning when it exceeds 60 °C.

The module is enclosed to protect the components. Liquid cooling and a 2400-W resistive load rating allow for use in a variety of applications from very low power to the full rating of the module. The low-inductance design enables testing of high-speed pulsed applications.

Features include ring lug or DSUB connections; low-inductance for use in fast rise and fall time pulsed applications; and RoHS compliance.


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heat sink
A series of flanges or other conducting surfaces, usually metal, attached to an electronic device to transmit and dissipate heat that might damage internal circuitry.
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