Search Menu
Photonics Media Photonics Buyers' Guide Photonics EDU Photonics Spectra BioPhotonics EuroPhotonics Industrial Photonics Photonics Showcase Photonics ProdSpec Photonics Handbook
More News
Email Facebook Twitter Google+ LinkedIn

  • SPiiPlusCMhp/ba Control Module
Aug 2013
ACS Motion Control Inc.Request Info
EDEN PRAIRIE, Minn., Aug. 7, 2013 — ACS Motion Control’s SPiiPlusCMhp/ba control module and EtherCAT master provides 2- or 3-axes motion stage and flexible configurations with additional axes and I/O’s. The device is suited for manufacturers of wafer and flat panel inspection equipment; laser cutting, printing, scribing and annealing equipment; CT and x-ray imaging equipment; and industrial servo-driven material puller/cutter equipment.

The device features three built-in 1- to 5-kW universal drives as well as a 20-kHz sampling rate, powerful control algorithms, and incremental and absolute encoder interfaces to deliver servo performance, short move and settle, minimal jitter, improved smoothness, multiaxis synchronization and robustness.

As an EtherCAT network master, the device controls and synchronizes up to 32 axes and thousands of I/O. Its open architecture operates in conjunction with the company’s line of EtherCAT servo, step motor drives and I/O modules, as well as with any certified EtherCAT module that complies with CAN-over-EtherCAT (CoE) protocol.

The module is fully supported by the SPiiPlusNT Suite application development studio for network setup, drive configuration, axis tuning, and multiaxis application programming. The suite also includes a full PC-based controller simulator.


* Message:
(requirements, questions for supplier)
Your contact information
* First Name:
* Last Name:
* Email Address:
* Company:
Address 2:
Postal Code:
* Country:
Phone #:
Fax #:

Register or login to auto-populate this form:
Login Register
* Required
The process of heating and slowly cooling a solid material, like glass or metal, to stabilize its thermal, electrical or optical properties or, as in semiconductor materials, to reverse lattice damage resulting from ion implantation of dopants.
The process of perforating a silicon or ceramic substrate with a series of tiny holes along which it will break. Nd:YAG or CO2 lasers are now routinely used.
Terms & Conditions Privacy Policy About Us Contact Us
back to top

Facebook Twitter Instagram LinkedIn YouTube RSS
©2016 Photonics Media
x We deliver – right to your inbox. Subscribe FREE to our newsletters.