FLANDERS, N.J., Sept. 5, 2013 — Rudolph Technologies Inc. has added a streamlined version of its automated macro defect inspection and metrology systems to its NSX line. The NSX 220 was designed for inspection of wafers up to 300 mm at traditional semiconductor, MEMS and LED manufacturing facilities. The system uses grayscale image analysis (with color image capture) and can detect advanced macro defects such as scratches, voids, foreign materials, and mechanical and probe damage, while performing 2-D measurements on bumps, probe marks and edge-trim processes. It operates over a 10- to 0.5-µm range of resolutions with both bright-field and optional dark-field illumination. Designed for back-end facilities that do not need the full suite of capabilities offered by its predecessor, the system provides centrally managed recipe creation and editing, enabling multiple NSX 220 tools to share a single recipe and be matched across the fab.