ContourSP 3-D Optical Microscope
Dec 2013Bruker Nano SurfacesRequest Info
TUCSON, Ariz., Dec. 17, 2013 — Bruker Corp. has launched the ContourSP, a large-panel 3-D metrology system for gauging individual layers of printed circuit board (PCB) panels during manufacturing.
Based on white-light interferometry, the technology is designed to enable minimum recipe development time, maximum uptime, and increased measurement throughput of high-density interconnect substrates in multichip modules.
The system features the proprietary Vision64 operating and analysis software.