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MicroLine 2000 UV Laser PCB Depaneling Systems

LPKF Laser & Electronics, Plastics Welding Div.

TUALATIN, Ore., Dec. 20, 2013 — LPKF Laser & Electronics has announced the MicroLine 2000 series UV laser cutting systems for printed circuit board depaneling, which will be available in early 2014.

The series features a low-stress UV laser source that eliminates mechanical stress and can process a wide variety of circuit materials, including flexible, rigid and rigid-flex substrates.

The systems are available in either a stand-alone or in-line configuration and can be equipped with a 6- or 12-W laser source.


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