MicroLine 2000 UV Laser PCB Depaneling Systems
LPKF Laser & Electronics, Plastics Welding Div.
TUALATIN, Ore., Dec. 20, 2013 — LPKF Laser & Electronics has announced the MicroLine 2000 series UV laser cutting systems for printed circuit board depaneling, which will be available in early 2014.
The series features a low-stress UV laser source that eliminates mechanical stress and can process a wide variety of circuit materials, including flexible, rigid and rigid-flex substrates.
The systems are available in either a stand-alone or in-line configuration and can be equipped with a 6- or 12-W laser source.
REQUEST INFO ABOUT THIS PRODUCT