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ReadyMount

Photonics.com
Aug 2014
SemiLEDs Corp.Request Info
 
CHUNAN, Taiwan, Aug. 27, 2014 — The ReadyMount Enhanced CSP (chip-scale package) from SemiLEDs is a series of packaged white emitter surface-mount components that combine Enhanced Flip chip and ReadyWhite phosphor technology.

The chip can produce outputs of up to 300 lumens at 1A using an input power of 3 W, and is available in color temperatures ranging from 2700 to 10,000 K, with color rendering indices up to 90 minimum in a 145° field of view.

Applications include indoor and outdoor lighting, architectural lighting, torches/flashlights, mobile device flashes and LCD backlighting.


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