Thickness Analysis System
Sep 2014Advantest America Inc.Request Info
TOKYO, Sept. 30, 2014 — Based on advances in terahertz technology, the TS9000 from Advantest nondestructively measures the thickness of semiconductor packaging.
The TS9000 enables rapid, repeatable and accurate measurements of mold thickness without the limitations of existing measurement methods. It can be deployed at various points in the assembly and packaging process, even immediately after the curing process, enabling easier detection of production issues in high-volume manufacturing.
Terahertz radiation is used to penetrate into many materials, including ceramics, silicon and plastic polymers, even if the materials are optically opaque. This allows for nondestructive layer thickness measurement in a wide variety of materials.
Rapid fiber-coupled pulsed laser generation enables speed, accuracy and throughput suitable for a high-volume manufacturing environment.