NORWOOD, Mass., Nov. 21, 2014 — Remtec has expanded its LED substrate and submount design capabilities with bond-pad down (flip-chip) packaging and selective gold-tin plating, among other features. The metallized LED substrates and submounts can be custom tailored to match required performance, power level or assembly needs. The devices use a variety of technologies on alumina, AIN and BeO ceramics, including PCTF with 20- to 75-µm copper, AgENIG and DBC with 125- to 250-µm copper. LED substrates for bond-pad down devices allow narrow gap capability for 50-µm-wide gaps suitable for InGaN, GaAs and other LED devices. They enable direct eutectic die attachment, eliminating the need for wire bonds and ensuring superior thermal and electrical performance for the next generation of solid-state LED devices.