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LED Thermal Interface Material

Photonics.com
Jan 2015
Indium Corp.Request Info
 
CLINTON, N.Y., Jan. 7, 2015 — Heat-Spring from Indium Corp. is a compressible, recyclable, metal thermal-interface material for LED manufacturing.

The material provides 86 W/mK of thermal conductivity using a pressure range of 35 to 100 psi.

Heat-Spring will not bake out or pump out, optimizing long-term performance consistency.


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GLOSSARY
indium
Metal used in components of the crystalline semiconductor alloys indium gallium arsenide (InGaAs), indium gallium arsenide phosphide (InGaAsP), and the binary semiconductor indium phosphide (InP). The first two are lattice-matched to InP as the light-emitting medium for lasers or light-emitting diodes in the 1.06- to 1.7-µm range, and the last are used as a substrate and cladding layer.
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