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Laser Diode Packages

Photonics.com
Mar 2015
SCHOTT North America Inc.Request Info
 
ELMSFORD, N.Y., March 19, 2015 — Schott TEC TO packageTransistor outline (TO) packages from Schott North America Inc. are suited for 10-Gb/s laser diodes in high-frequency, actively cooled communications applications.

The TEC TO package features a thermoelectric cooler that allows for controlled heat dissipation, which leads to regulated and stable laser wavelengths.

Since the package is based on a TO footprint, it is also reduced in size compared to the conventional box packages.

The new design is also based on an extended radio-frequency feedthrough, which boasts shortened wire bonds to minimize signal losses to the laser diode, improving the overall performance.


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