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  • OSI Optoelectronics Introduces Back-Illuminated Silicon Photodiodes

OSI Optoelectronics Inc.Request Info
BI-SMT Photodiode Series from OSI OptoelectronicsOSI Optoelectronics (OSIO), an OSI Systems Company and global supplier of high performance standard and OEM photodiodes, high power light sources, and turnkey solutions, introduces the BI-SMT Photodetector Series. The new single-channel, back-illuminated silicon photodiodes are specifically designed to minimize any “dead” areas on the edges of the devices. Each photodiode is designed on a square surface mount package with dimensions similar to the actual chip. This makes it possible to have multiple detectors arranged in a tiled pattern for easy coupling to a scintillator.

There are currently three BI-SMT devices: The 33BI-SMT features an active area of 5.76 mm² (dimensions are 2.4 x 2.4 mm); the 55BI-SMT has a19.36 mm² active area (4.4 x 4.4 mm dimensions); the 1010BI-SMT features a larger 88.36 mm² active area (9.4 x 9.4 mm dimensions). The typical peak spectral responsivity for all three photodiodes is 920 nm. The BI-SMT series are used in X-ray inspection, computed tomography, and general industrial tasks. Convenient and easy to integrate into new and/or existing systems, OSI Optoelectronics’ unique devices feature chip size packaging, easy coupling to scintillators, and patterned electrodes. Operating temperatures range from -20°C ~ to +60° degrees C; storage temperatures range from -20°C ~ to +80° degrees C.

OSI Optoelectronics also offers engineering, prototyping, and contract manufacturing services for medical, military, security, industrial, commercial and semiconductor manufacturing markets. With vertical integration and assembly of optoelectronic devices, OSI delivers complete product engineering and design, manufacturing, assembly, and inspection services to meet customer requirements.

The company recently introduced a broad range of cable and harness assembly services. Ideal for applications in medical and military markets, these include low-volume, complex hand-assembled harnesses to high-volume, semi-automated lines using automated wire cutting and stripping, splicing transfer molding, auto-crimping, connector-over-molding, strain-relief molding, and more.

For more information about OSI Optoelectronics, please visit:


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