PROVIDENCE, R.I., Sept. 22, 2015 — Custom-fabricated sapphire wafer carriers from Meller Optics Inc. feature uniform thickness and parallelism, and are highly durable for thinning semiconductors. The carriers feature Moh 9 hardness, allowing them to be produced as thin as 0.018-in. with 1.2-μm uniform thickness and 10-arcsec parallelism. Custom perforated with hole patterns to fit vacuum hold-down or delamination fixtures, they facilitate semiconductor thinning to assure consistent part-to-part uniformity. Available in 2- to 6-in. diameters, the carriers can be supplied with reference flats and laser markings. Capable of withstanding repeated use, the carriers are hard, strong, chip- and scratch-resistant, and are impervious to solvents and etchants.