Feb 2016LPKF Laser & Electronics AGRequest Info
HANNOVER, Germany, Feb. 17, 2016 — LPKF Laser & Electronics AG has announced the MicroLine 5000 UV laser-based flex drilling system.
The system drills blind bias and through holes at high speeds, and contour cuts flexible circuits. Its laser beam spot is 20 µm, allowing for the precise cuts of intricate flex circuit geometries.
Operating in the UV wavelength range, the laser system drills and cuts delicate substrate materials with a minimal heat-affected zone. It can also be configured for reel-to-reel handling of flex substrates. Two different power classes are available for the flexible circuit industry.