GARBSEN, Germany, April 4, 2016 — LPKF Laser & Electronics AG has announced the MicroLine 5000, a UV laser-based flex drilling system in two power classes. With a working area of 21 × 24 in., the laser is equipped with precise process monitoring and intelligent vision systems for fiducial recognition and alignment. Although the system is mainly focused on the high-speed drilling of both blind vias and through holes, it is also equally effective for the contour cutting of flexible circuits. UV wavelength operation allows the drilling and cutting of substrate materials with a minimal heat affected zone. With a laser beam spot size of 20 μm, the MicroLine 5000 allows for precise cuts of intricate flex circuit geometries. The system can also be configured for reel-to-reel handling of flex substrates.