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  • Surface Processing Platforms
May 2016
SUSS MicroTec AGRequest Info
GARCHING BEI MUNCHEN, Germany, May 26, 2016 — Surface Processing PlatformsSuss Microtec Lithography GmbH has announced the LI Laser Imaging series, a versatile surface processing platform.

Process capabilities of the system range from submicron patterning of resist coated substrates to micro-ablation, photo-chemistry treatment and metrology. A lens focusing set is included in the base system. It is also possible to process small wafer pieces and add a second laser source of choice. Multiple patterning modes are available.

The system is suited for academic and industrial R&D facilities. Main applications include nano- and 3D structuring for high-resolution wafer lithography, micro-optical components, sensors, microfluidic devices and photo mask manufacturing.


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A cross-sectional slice cut from an ingot of either single-crystal, fused, polycrystalline or amorphous material that has refined surfaces either lapped or polished. Wafers are used either as substrates for electronic device manufacturing or as optics. Typically, they are made of silicon, quartz, gallium arsenide or indium phosphide.
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