Package Inspection System
Jul 2016TeraView Ltd.Request Info
SAN FRANCISCO, July 15, 2016 — TeraView Ltd. has announced the EOTPR 5000 integrated circuit package inspection system.
The fully automated system utilizes TeraView’s proprietary EOTPR terahertz technology to detect weak or marginal interconnect quality in high-volume manufacturing environments,
Users can detect minute shifts in impedance changes from weak or marginal interconnects after accelerated life tests or high-temperature cycle tests. The same principle applies to the detection and reduction of manufacturing variations to improve packaging-related yield.