WILMINGTON, Mass., July 18, 2016 — Rudolph Technologies Inc. has announced its patented Clearfind imperfection detection technology for advanced packaging inspection, which can identify organic defects that are difficult or impossible to see with conventional white-light imaging techniques. Clearfind technology highlights organic residues on bumps and bond pads or at the bottoms of vias for easy detections. On metals, it eliminates the high-contrast graininess seen under conventional illumination, resulting in an obvious defect signal against a featureless background. This same graininess in conventional imaging can also cause costly false positives. Clearfind technology readily detects shorts and opens in metal lines when inspected with an underlying organic layer. These capabilities significantly increase its customer’s ability to detect process and manufacturing related issues earlier in the process, resulting in significant yield cost savings.