MINI COOLING SYSTEMS
May 1997ACK Technology Inc.Request Info
ACK Technology Inc. has designed a series of thermoelectric cooling
systems for cooling small devices such as laser diodes, photodetectors
and enclosures in the laboratory. Measuring 80 3 87 3 70 mm, these
systems have cooling powers up to 30 W and an MTBF above 200,000 h.
Using a cooling module, heat sink and high-quality ball bearing fan,
they can remove heat from the cold plate and cool it to below freezing.
The cold plate has four 4-40 tapped holes for mechanical interface with
the samples to be cooled.