The new 40-3900 two-component epoxy adhesive from Epoxies Etc. is filled with pure silver. This electrically conductive epoxy resin has an electrical resistivity of less than 1 x 1024 (omega)/cm and operates in temperatures ranging from 250 to 170 °C. It can be used for chip bonding in microelectronic and optoelectronic applications. Because of its continuity, it can also be used in microwave EMI and RFI shielding; in the assembly or repair of printed circuit boards, waveguides, electronic modules and high-frequency shields; and as a cold solder.