A line of low-light-level back-thinned full-frame-transfer CCD sensors is offered by Hamamatsu Corp. The devices, which contain both a three-stage thermoelectric cooler and a CCD chip in a hermetically sealed package, have active areas ranging from 1.54 x 1.54 mm to 5.2 x 1.2 mm. They feature multiphase pinning operation, low dark output and longer integration time. Their main application is as a replacement for avalanche photodiodes on cooled photodiodes. The company says light incident on the devicesO backsides can be detected with high quantum efficiency from the UV to the near-IR.