Rudolph Technologies
Wafer Scanner 3840
FLANDERS, N.J., May 19, 2008 -- Rudolph Technologies Inc., a provider of metrology, defect inspection and data analysis systems used by semiconductor manufacturers, has added the WS 3840 to its wafer scanner products for inspection and metrology of bumping, probing, sawing and dicing processes. The first order is scheduled for shipment in the third quarter of this year.
Rudolph integrated the wafer scanner into its inspection unit, based in Bloomington, Minn., soon after it bought the IP and assets of RVSI Inspection LLC in January. (See also:
Rudolph Technologies Secures RVSI Inspection IP, Assets)

“Rajiv Roy, Rudolph’s marketing director for back-end inspection systems, said, “Since January, we have shipped several WS3800 3-D bumped wafer inspection systems to satisfy existing orders. The first WS3840 system will be delivered to a major Asian foundry, where it will be used to process advanced bump wafers.”
“As the cost of advanced packaging processes grows, manufacturers have come under increasing pressure to control performance within narrowing process windows and the economic benefits of fast, accurate inspection and metrology have multiplied,” Roy said.
The WS 3840 uses laser triangulation technology to provide measurements of bump height and coplanarity. A time-delay integration (TDI) line scan camera provides image-based macro defect inspection for wafer surface and bump and measures two-dimensional bump characteristics, such as diameter, shape and placement accuracy. High-resolution color imaging is also available for defect review and classification.
Rudolph's inspection platform, with 200- and 300-mm wafer handling capability, combines robots and intelligent scheduling capabilities to perform automatic defect classification and analytical routines. It imports and exports wafer maps in standard data formats to facilitate offline defect review. The WS 3840 integrates Rudolph’s laser triangulation technology for 3-D bump metrology and 2-D image-based macro defect inspection.
For more information, visit:
www.rudolphtech.com; e-mail:
info@rudolphtech.comRudolph Instruments Inc.
400 Morris Ave., Ste. 120
Denville, NJ 07834
Phone: (973) 983-6700
Fax: (973) 983-6290
Start a discussion on this article or any photonics topic in the Photonics.com Community Forum