Henkel’s electronics group has announced that its Loctite Chipbonders 3609, 3616, 3621, 3627 and 3629 have been proved to run lead-free and are designed to optimize lead-free processes, eliminating chip loss. During the trials, a range of Loctite Chipbonder adhesives were tested on difficult-to-bond components. Using Loctite Chipbonder test boards, the trials employed both lead-free and tin-lead dual-wave solder machines and a variety of Multicore fluxes. The higher temperatures required by lead-free wave soldering reduce the mechanical strength of adhesives.

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