Feinfocus GmbH and Xradia Inc. have announced their 3-D x-ray inspection technology for the semiconductor packaging and medical device industries. The microXCT defect detection system uses nondestructive 3-D tomography to view the complete structure of advanced packages at full resolution. Multiple resolution modes allow the user to switch from navigation at 30 μm to high-resolution defect localization and characterization at 1 μm. The automated 3-D tomography features virtual cross-section capability and eliminates the need for sample preparation. The system images and constructs a high-resolution 3-D volumetric data set with up to 1000 cross-sectional slices in 15 min.

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