A dual-cure (UV/heat curable) epoxy system called UV15DC80 has been developed by Master Bond Inc. for bonding, sealing, coating and potting applications. The compound has a low viscosity, is easy to apply and requires no mixing. It also contains no solvents or volatiles, is not inhibited by oxygen, and has low shrinkage upon cure. The epoxy can cure in shadowed areas by supplemental heat or using UV light. Shore D hardness is >70, elongation after cure is 3 to 4 percent, tensile strength is >4200 psi, and its refractive index is 1.517.

To contact the manufacturer of this product, click here.

Start a discussion on this article or any photonics topic in the Photonics.com Community Forum