HyLED silicon-based packaging for high-brightness LEDs has been announced by Hymite A/S. It enables component miniaturization and cost-effective manufacture. Based on silicon wafers and batch micromachining/metallization processes, it reduces package size by up to four times. Integrated-circuit style automated manufacturing increases both throughput and yields and lowers cost per unit. The silicon offers good thermal management, and the package design alleviates thermal and thermomechanical stress for high performance. The micromachined LED cavity acts as a reflector, thermal conductor and reservoir for silicone.

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