Article Abstracts | August 2007
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Wafer-Level Camera Technologies Shrink Camera Phone Handsets
Applying microelectronics techniques to optics enables economies of scale for next-generation phones.
by Michael Feldman, Tessera North America
Wafer-level optics is a novel technology that is designed to meet the demand for smaller form factors, higher resolution and cost-effective pricing in the next generation of camera phones. The optical components are fabricated on glass wafers in a manner similar to that of fabricating integrated-circuit chips on silicon wafers. The entire camera is aligned and assembled at the wafer level and subsequently diced to form individual camera modules.
The size of a camera module, often the largest component on a board, is a primary factor limiting handset design. Ideally, the camera would be located in the lid of a clamshell design. However, current handset designs often place the camera in the hinge of the phone (Figure 1); otherwise, the camera is limited to VGA resolution (640 × 480) to allow it to fit within the lid...
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