LEW Techniques Ltd. is offering laser diode heat sinks with supersharp edges, flat and smooth die bonding surfaces, and optional predeposited gold/tin solder to enable positioning of high-power laser diodes right to the edge of the mount to minimize hot spots and voiding. C-mounts are fabricated from copper with optional expansion-compensating tungsten/copper inserts in the laser bonding area for maximum thermal conductivity. Smaller Q- and W-mounts can be fabricated completely from tungsten/copper, and strongly attached standoff ceramics, with or without tags, also are available.

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