EP30P is a two-component, transparent, low-viscosity epoxy system produced by Master Bond Inc. for bonding, sealing, coating, encapsulation and casting applications. It has a 4:1 mix ratio by weight and cures at room temperature. It bonds to a variety of substrates, including metals, glass, ceramics and plastics. Operating temperature ranges from –60 to 250 °F. The 100% reactive system contains no solvents or diluents, offers low linear shrinkage upon cure, is resistant to water, acids, bases and salts, and provides good electrical insulation. Tensile strength is >9500 psi. Mixed viscosity is 1200 to 1400 cps.

To contact the manufacturer of this product, click here.

Start a discussion on this article or any photonics topic in the Photonics.com Community Forum