Cutting Edge Optronics Inc., a business unit of Northrop Grumman Corp.’s space technology sector, has released next-generation high-power diode laser packaging technology with the introduction of the Golden Bullet family. The products feature proprietary expansion-matched materials and hard solder, making them suitable for operation in >500-μs pulsed laser applications and in temperatures of >50 °C. The packages have undergone thousands of hours of testing and have shown no sign of solder creep or migration onto the diode laser facets. The components are offered on more than 150 standard diode heat sink designs, including G, A, AA, W2, E1, E2 and CS packages. They feature long-life diode bars with CW and quasi-CW power ratings of >100 W.

To contact the manufacturer of this product, click here.

Start a discussion on this article or any photonics topic in the Photonics.com Community Forum