A two-component room-temperature-curing epoxy adhesive, sealant and coating has been developed by Master Bond Inc. The EP21HT polymer system offers a 1:1 mix ratio by weight or volume. It is 100% reactive, contains no solvents or volatile substances and has a service operating temperature range of –60 to 400 °F. Physically strong, the adhesive bonds well to similar and dissimilar substrates, including glass, wood, metal, ceramic, rubber and plastic. Once cured, it offers electrical insulation properties, and it can withstand exposure to thermal cycling and various chemicals, including water, oil, fuel, acid, bases and salts. With a Shore D hardness of >70, tensile strength of >8000 psi and tensile modulus of >350,000 psi, it meets the requirements of MIL-A-81236 (OS) and other standards.

To contact the manufacturer of this product, click here.

Start a discussion on this article or any photonics topic in the Photonics.com Community Forum