Tessera Inc.’s OptiML wafer-level camera technology is designed to advance the integration of miniaturized cameras into cellular phones, PCs, security cameras and other portable electronic devices. To manufacture cameras at the wafer level, thousands of lenses are built simultaneously on a wafer, and the lens wafers are aligned and bonded via the company’s OptiML WaferStack technology. The bonded lens wafers are diced into individual integrated optical elements that can be mounted onto a packaged image sensor. The cameras deliver video-graphics-array to multimegapixel resolution. The technology enables camera module assembly via standard reflow processes and eliminates the need for manual focus adjustment of the optical elements.

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