Oerlikon Optics has added b-stage epoxy printing and processing to its portfolio of cover glasses, rendering them suitable for a greater variety of applications. The packaging of light-sensitive semiconductor devices consists of a cover glass mounted to a ceramic backplane. The epoxy is used to assemble the two pieces. Its curing at the time of packaging is done by tempering, at 120 to 150 °C, depending on the epoxy. The process reduces the need for chemical handling. Because the epoxy is available in black, it may be applied as an aperture to protect underlying electronics from light.

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