XSiL Ltd. has launched a laser dicing system that is designed to process thin silicon wafers. The X300D+, which is developed on the company’s Xise300 platform, can fully automate handling of wafers up to 300 mm, dicing on standard polyolefin tapes and 2-in-1 die-attach film, and scribing of low-k oxides and metals. Wafers are diced with a high-power UV diode-pumped solid-state laser at 355 nm. Silicon and die-attach film are cut with minimal damage and no chipping at high speeds.

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