Seica Inc. has introduced a software update for the FireFly laser-based selective soldering system. The package’s automatic development environment reduces the program preparation time for soldering printed circuit boards. Other features include improved algorithms and faster loop control, resulting in higher soldering stability. Precise X-Y-Z control positions the laser beam, rotating it as much as 180° around the pin or joint to be soldered.

To contact the manufacturer of this product, click here.

Start a discussion on this article or any photonics topic in the Photonics.com Community Forum