Dongbu HiTek Co. Ltd. has launched a design library to support CMOS image sensor processing at the 110-nm node. Designed for mobile handset applications, the device enables low leakage of current in standby status and resolution of up to 5 megapixels in camera phones. Chips that migrate from the company’s 130-nm to 110-nm node achieve up to 30% reduction in feature size, which yields more useful chips per wafer and results in a technology that is more cost-effective.

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