Nextreme Thermal Solutions Inc.’s ultrahigh packing fraction OptoCooler module is optimized for laser diode, LED and advanced sensor products. With a footprint of 0.55 mm², the cooler removes 420 mW and pumps heat density up to 78 W/cm² at 25 °C ambient. At 85 °C, the device removes 610 mW and pumps heat density up to 112 W/cm². It features thin-film thermal bump technology, millisecond response time and broad temperature range capabilities.

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