Fraunhofer IPMS will present highly efficient OLEDs, integrated into silicon backplanes in the form of rows or arrays, for optoelectronic and microdisplay applications.  OLED technology allows both large-area deposition and micropatterning of light emitters on the uppermost metal layers of CMOS chips, enabling active area space below the OLED electrode to be available for additional circuitry in a system-on-chip setup, including OLED driving.