Imra, Disco Collaborate
Femtosecond fiber laser manufacturer !%Imra America Inc.%! of Ann Arbor, Mich., a subsidiary of Aisin Seiki Co. Ltd. of Kariya, and Disco Corp. of Tokyo have teamed to develop lasers and processing systems for dicing of semiconductor materials. The companies will provide solutions that use the capabilities of femtosecond lasers, which feature minimal thermal effects in materials processing. Imra is the exclusive licensee of US Patent No. 5,656,186 by the University of Michigan, essential for femtosecond and picosecond laser materials processing, which it licenses to its customers. Disco manufactures precision cutting, grinding and polishing machines.
LATEST NEWS
- Optogenetic Stimulation Enables Fatigue-Resistant Muscle Control
Jun 6, 2024
- Quandela Launches Pilot Line for Qubit Devices
Jun 6, 2024
- Lattice Semiconductor Adds Interim CEO
Jun 6, 2024
- On-Chip Microcomb Laser Provides Greater Control
Jun 5, 2024
- Flexible, Stretchable Device Addresses Tuning Limitations in Structural Color
Jun 5, 2024
- Fusion Startup Xcimer Raises $100M, Plans Laser Prototype
Jun 4, 2024
- ASML and imec Debut Joint Lithography Lab
Jun 4, 2024
- Photonic and Microsoft Detail Quantum Computing Milestone
Jun 4, 2024