Irvine Sensors Receives More Funds for Laser Imaging Program

COSTA MESA, Calif., June 14 -- Irvine Sensors Corp. has received approximately $1.3 million of additional funding for the development of a 3-D imaging (3DI) integrated circuit to interpret reflected signals from laser flashes. A preliminary demonstration of the 3DI chip supported Irvine's bid for the recently announced Jigsaw System award. Jigsaw is designed to enhance combat target detection and identification by use of laser imaging.

Irvine's approach involves the stacking of 3DI chips that can operate at ultrahigh speeds to enhance performance achievable with the Jigsaw concept. Under the additional 3DI funding, which is separate from the funding to be received under its Jigsaw contract, Irvine Sensors plans to refine the design of and fabricate 3DI chips that can be stacked into a sensor module for field demonstrations of the Jigsaw system scheduled to occur in less than a year. The program is funded by the Defense Advanced Research Projects Agency and managed by the US Navy's Office of Special Technology.