Wafer Processing Yields High Q Microcavities
Microcavities require atomically smooth surfaces to obtain ultrahigh Q factors, but until recently such surfaces have been demonstrated only in structures such as droplets or microspheres. Researchers at
California Institute of Technology in Pasadena have found a way to obtain ultrahigh Q using wafer-scale processing.
As described in the Feb. 27 issue of
Nature, they first created support pillars using photolithography, pattern transfer into the silicon dioxide and selective dry etching of the exposed silicon. They then heated the silicon dioxide to reflow it and forced the molten disc into a toroid-shaped microcavity with an atomically smooth surface and a Q of greater than 100 million.
LATEST NEWS
- Exail Signs LLNL Contract, Partners with Eelume
Apr 26, 2024
- Menlo Moves U.S. HQ: Week in Brief: 4/26/2024
Apr 26, 2024
- Optofluidics Platform Keys Label-, Amplification-Free Rapid Diagnostic Tool
Apr 25, 2024
- DUV Lasers Made with Nonlinear Crystals Enhance Lithography Performance
Apr 25, 2024
- Teledyne e2v, Airy3D Collaborate on 3D Vision Solutions
Apr 24, 2024
- One-Step Hologram Generation Speeds 3D Display Creation
Apr 24, 2024
- Innovation Award Winners for Laser Technology Honored in Aachen
Apr 23, 2024
- Intech 2024: AI Arrives on the Shop Floor
Apr 22, 2024