DALSA Receives Digital Camera Contract

WATERLOO, Ontario, Sept. 24 -- DALSA Corp. announced it has received a $1.9 million camera development contract from a leading manufacturer of semiconductor wafer inspection systems.

DALSA will produce high-performance digital cameras that will be used to inspect semiconductor wafers at extremely high speeds and low light levels. The cameras will be the "electronic eyes" for inspection systems.

DALSA said the order is its third camera development contract from a semiconductor equipment manufacturer this year.

For more information, visit: www.dalsa.com

LATEST NEWS

• IPG Names Industry Veteran Mark Gitin CEO
  Apr 30, 2024
• 16th Biannual Optatec Conference Continues in Frankfurt
  Apr 30, 2024
• Celestial Surface Mapping Tech Combines Established Techniques
  Apr 30, 2024
• TSMC Partnerships Target Integrated Photonics Capabilities
  Apr 30, 2024
• CLEO Heads to the East Coast
  Apr 29, 2024
• Laser-Based Gas Analyzer Developed to Detect Air Pollution
  Apr 29, 2024
• Qubits Could be Stored in Flash-Like Memory
  Apr 29, 2024
• Exail Signs LLNL Contract, Partners with Eelume
  Apr 26, 2024