Photonics Spectra BioPhotonics Vision Spectra Photonics Showcase Photonics Buyers' Guide Photonics Handbook Photonics Dictionary Newsletters Bookstore
Latest News Latest Products Features All Things Photonics Podcast
Marketplace Supplier Search Product Search Career Center
Webinars Photonics Media Virtual Events Industry Events Calendar
White Papers Videos Contribute an Article Suggest a Webinar Submit a Press Release Subscribe Advertise Become a Member


Transponder Manufacturers Develop Joint Optical Multisource Agreement

GLASGOW, Scotland, Sept. 22 -- Optical communications companies Essex Corp. of Columbia, Md., Kodeos Communications Inc. of South Plainfield, N.J., and TeraSea Ltd. of Israel have formed a 10 Gb/s, optical, duo-binary multisource working group (ODB MSWG) to develop a common specification for extended reach 10 Gb/s transponder modules. The ODB MSWG will allow service providers and OEMs to contribute to a multisource forum while providing a mechanism that facilitates interoperability between participants.

These optical transponder modules are initially targeted for extended reach applications up to 200 km and support data rates from 9.95 to 11.3 Gb/s. The companies say the inherent aspect of optical duo-binary transmission offers network designers flexibility, longer reach and better performance while saving manufacturing costs on next generation systems.

"Any time multiple manufacturers join forces to set standards that ensure interoperability between their products, the industry as a whole benefits," says Robert Pease, contributing technical editor for several telecom trade publications and president of Write-Way Independent Editorial Services LLC. "This collaboration not only establishes common ground for manufacturers in the development of these transponder products, but it also offers service providers a voice in the design process. Soliciting customer input and acting on it is the success story of many top optical equipment companies."

The ODB MSWG says it intends to release the first open multisource specification by December, based on the 300-pin transponder multisource agreement. The module would meet the 3.5 in. by 4.5 in. by 0.53 in. industry standard form factor.

For more information, visit: www.essexcorp.com, www.tera-sea.com or www.kodeos.com.



Explore related content from Photonics Media




LATEST NEWS

Terms & Conditions Privacy Policy About Us Contact Us

©2024 Photonics Media