European Group Studies Device Packaging
A European research-and-development initiative, Encaps (enabling chip and package level photonics solutions) has been formed to develop cost-effective packaging methods for next-generation optoelectronic products. The expense of assembly and packaging has been a bottleneck to the mass production and deployment of photonic products.
The consortium consists of 22 partners representing industries, universities, reliability laboratories and research centers engaged in photonics research. Among them are NovaPack Technologies of Trappes, France, and Dow Corning Ltd. of Coventry, UK.
The project will explore materials such as silicone, getters, liquid crystal polymers and encapsulants for optical chip-scale packages, combined with collective chip and optics assembly and sealing processes at wafer and package levels. It was designed to generate knowledge about materials behavior, construction reliability and lifetime prediction. Applications at various levels of hermeticity requirements, including vacuum conditions, will be addressed.
LATEST NEWS
- Laser-Based Gas Analyzer Developed to Detect Air Pollution
Apr 29, 2024
- Qubits Could be Stored in Flash-Like Memory
Apr 29, 2024
- Exail Signs LLNL Contract, Partners with Eelume
Apr 26, 2024
- Menlo Moves U.S. HQ: Week in Brief: 4/26/2024
Apr 26, 2024
- Optofluidics Platform Keys Label-, Amplification-Free Rapid Diagnostic Tool
Apr 25, 2024
- DUV Lasers Made with Nonlinear Crystals Enhance Lithography Performance
Apr 25, 2024
- Teledyne e2v, Airy3D Collaborate on 3D Vision Solutions
Apr 24, 2024
- One-Step Hologram Generation Speeds 3D Display Creation
Apr 24, 2024