Rudolph Receives Multiple-System Order

Rudolph Technologies Inc. of Flanders, N.J., has been awarded a multiple-system order from a US semiconductor manufacturer for its all-surface advanced macrodefect-detection system. The system consists of modules for front-side inspection, back-side inspection and a wafer edge inspection system. The modules allow automatic detection, classification and correlation of defects in semiconductor wafers for deposition, lithography, etch and chemical mechanical planarization applications.